Failure Analysis Services in India
When a component fails unexpectedly, G-Hexa investigates the material, manufacturing, surface, and service factors that may have contributed to the failure. Our Bengaluru, Karnataka team combines microscopy, spectroscopy, and materials characterization to build an evidence-based root cause assessment for clients across India.
Submit Your CaseFailure Analysis Services We Investigate
Explore common failure modes, material problems, manufacturing defects, corrosion mechanisms, wear patterns, battery failures, and semiconductor failure investigations.
Metal and Alloy Failure
Unexpected fracture or deformation
Gear Failure
Pitting, tooth breakage, scoring
Bearing Failure
Spalling, wear debris, seizure
Shaft Failure
Fatigue cracking, torsional failure
Weld Failure
Porosity, cracking, incomplete fusion
Corrosion
Pitting, stress corrosion cracking
Coating Failure
Delamination, blistering, wear through
Crack Analysis
Origin identification, propagation path
Fractography
Fracture surface examination
Fatigue
Beach marks, striations
Wear
Abrasive and adhesive wear patterns
Contamination Analysis
Foreign particles, inclusions
Heat Treatment Issues
Incorrect hardness, microstructure
Material Defects
Porosity, segregation, inclusions
Manufacturing Defects
Process induced flaws
Battery Failure
Capacity fade, thermal events, dendrites
Semiconductor Failure
Gate oxide breakdown, dopant fluctuation
Learn More About Each Category
General approach for each failure type. The exact technique used is confirmed after reviewing your specific case.
Unexpected metal fracture or deformation can arise from material defects, process errors, or in service loading conditions. We combine microscopy and metallurgical examination to identify the underlying cause.
Techniques commonly used: FESEM, EBSD, metallography.
Gear failures such as tooth pitting, breakage, or scoring are examined to determine whether the root cause is material quality, heat treatment, lubrication, or loading conditions.
Techniques commonly used: FESEM, metallography, hardness testing.
Bearing spalling, seizure, and wear debris are analyzed to distinguish between contamination, misalignment, lubrication failure, and material related causes.
Techniques commonly used: FESEM, EDX analysis, metallography.
Shaft fatigue cracking and torsional failure are investigated through fracture surface examination to identify the crack origin and loading pattern that led to failure.
Techniques commonly used: Fractography, metallography.
Weld porosity, cracking, and incomplete fusion are examined to determine whether the issue originated from welding parameters, material compatibility, or joint design.
Techniques commonly used: FESEM, metallography, XRD.
Pitting corrosion and stress corrosion cracking are investigated to identify the corrosive mechanism and contributing environmental or material factors.
Techniques commonly used: FESEM/EDX, XRD, XPS.
Coating delamination, blistering, and wear through are examined to understand adhesion loss and interface quality between the coating and substrate.
Techniques commonly used: AFM, FESEM cross section, FIB.
Crack origin and propagation path are identified using fracture surface examination, helping determine whether cracking initiated from a defect, stress concentration, or material weakness.
Techniques commonly used: Fractography, FESEM.
Fracture surface features are examined in detail to determine the mode of failure, whether brittle, ductile, or fatigue related, and to trace the sequence of events leading to failure.
Techniques commonly used: FESEM, stereomicroscopy.
Beach marks and fatigue striations on a fracture surface confirm cyclic loading failure and help estimate the crack growth pattern over the component's service life.
Techniques commonly used: FESEM fractography.
Abrasive and adhesive wear patterns are analyzed to determine the underlying mechanism, whether from contamination, lubrication breakdown, or surface mismatch.
Techniques commonly used: FESEM, AFM, profilometry.
Foreign particles and inclusions are identified and traced back toward their likely source using surface and chemical analysis.
Techniques commonly used: FESEM/EDX, FTIR, XPS.
Incorrect hardness or microstructure resulting from heat treatment is examined to identify whether the process parameters, quenching, or material response caused the issue.
Techniques commonly used: Metallography, hardness testing.
Porosity, segregation, and inclusions present within the material itself are identified to determine whether the defect originated during material production.
Techniques commonly used: FESEM, XRD, Micro-CT.
Process induced flaws are distinguished from material or design related issues, helping identify whether a defect originated during forming, machining, or assembly.
Techniques commonly used: FESEM, Micro-CT, metallography.
Capacity fade, thermal events, and dendrite formation in lithium ion cells are investigated using techniques suited to air sensitive battery materials, handled under appropriate conditions.
Techniques commonly used: FESEM/EDX, XRD, XPS.
Gate oxide breakdown, dopant fluctuation, and wafer level defects are investigated using atomic scale techniques suited to modern semiconductor node dimensions.
Techniques commonly used: APT, TEM, FIB.
Have an urgent field failure or warranty case? Contact our team directly for faster intake coordination.
Chat on WhatsAppHow Do You Submit a Failure Analysis Case?
Samples may be submitted by courier or by scheduled drop off after prior coordination with the G-Hexa team. The final testing route, preparation need, and turnaround time will be confirmed after sample review.
Describe the Failure
Share the component, symptoms, and service conditions.
Sample Review
Our technical team confirms the investigation approach.
Submit Sample
Courier or scheduled drop off, based on prior coordination.
Root Cause Report
Standard turnaround 5 to 7 working days, rush support in 2 to 3 days where feasible.
Related Services
Failure Analysis FAQs
Urgent cases can be coordinated faster than our standard turnaround. Contact our team directly by phone or WhatsApp to discuss timelines for your specific case.
Details such as the component's service conditions, when the failure occurred, and any suspected cause help our technical team plan the right investigation approach.
Yes. Confidentiality requirements can be discussed with our team before your sample is submitted.
Yes. Every failure analysis case concludes with a documented report connecting the observed evidence to the likely root cause.
Need Failure Analysis or Root Cause Investigation?
Tell us about the component, failure symptoms, service conditions, and suspected issue. Our technical team will review the case and confirm the most appropriate investigation approach.
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