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TGA & DSC Thermal Analysis India | G-Hexa
TGA and DSC instruments used for thermal analysis of advanced materials
Thermal stability and transition analysis

TGA & DSC Thermal Analysis in India

TGA and DSC thermal analysis measures how a material responds to controlled temperature change. TGA can investigate mass loss, decomposition, moisture, oxidation, and residue, while DSC can identify glass transition, melting, crystallization, curing, and other heat-flow events in suitable samples.

TGA objectives

Thermal stability, moisture, solvent loss, decomposition stages, oxidation behavior, filler content, and final residue.

DSC objectives

Glass transition, melting, crystallization, curing, phase transitions, heat capacity, and thermal history.

Before submission

Share the material, expected transition or degradation range, sample mass, atmosphere requirement, and analytical objective.

Quick answer: TGA measures sample mass as temperature changes, helping identify moisture loss, decomposition, oxidation, filler content, and residue. DSC measures heat flow into or out of a sample, helping identify glass transition, melting, crystallization, curing, and other thermal transitions.
TGA thermal weight-loss curve showing staged material decomposition and residue
Illustrative TGA weight-loss curve showing staged decomposition and residue.
TGA analysis

What can thermogravimetric analysis reveal?

Thermogravimetric analysis records the change in sample mass while the sample follows a controlled temperature program. The resulting curve can show when volatile components leave, when decomposition begins, how many mass-loss stages occur, and how much residue remains.

TGA interpretation depends on heating rate, atmosphere, sample mass, pan type, temperature range, and the material’s thermal history.

Thermal stability
Moisture and solvent loss
Decomposition stages
Oxidation behavior
Filler and ash content
Final residue
Service scope

Choose the thermal analysis output your investigation needs.

The appropriate route depends on whether the primary question concerns mass change, heat flow, thermal transitions, decomposition, curing, or a combination of TGA and DSC behavior.

Thermal stability and decomposition

Investigate onset of mass loss, multistage decomposition, volatilization, oxidation, and thermal stability under selected conditions.

Glass transition and melting

Use DSC heat-flow response to investigate glass transition, melting, crystallization, solid-solid changes, and thermal history.

Curing and reaction behavior

Support formulation, polymer, resin, coating, catalyst, and advanced-material studies involving curing or heat-related reactions.

Working principle

How do TGA and DSC thermal analysis work?

A small sample is placed in a controlled thermal-analysis instrument and exposed to a programmed temperature profile. The instrument records either mass change, heat flow, or both depending on the selected method.

Atmosphere, heating rate, sample mass, pan type, and temperature range are selected according to the material and analytical objective.

  • Temperature program: heats or cools the sample under controlled conditions.
  • TGA signal: records sample mass as temperature or time changes.
  • DSC signal: records heat-flow differences associated with thermal transitions.
CONTROLLED ATMOSPHERE

Tap a component to see its role in TGA / DSC thermal analysis.

Thermal-analysis workflow, step by step

The sample is loaded into a suitable pan, the instrument applies the selected temperature program and atmosphere, sensors record mass or heat-flow response, and the resulting curves are interpreted against the material and requested objective.

DSC analysis

What can differential scanning calorimetry reveal?

DSC measures the difference in heat flow between a sample and reference as temperature changes. Heat-flow events can indicate glass transition, melting, crystallization, curing, phase change, or other thermal behavior.

Interpretation depends on heating and cooling cycles, heating rate, sample mass, pan configuration, atmosphere, and the material’s thermal history.

  • Glass-transition behavior
  • Melting and crystallization events
  • Curing and reaction peaks
  • Thermal-history comparison
DSC heat-flow curve showing glass transition, melting, and crystallization features
Illustrative DSC heat-flow curve showing thermal-transition features.
TGA and DSC application for polymer, battery, catalyst, and advanced-material thermal analysis
Thermal analysis can support polymer, battery, catalyst, coating, and advanced-material studies.
Applications

When do customers use TGA and DSC?

TGA and DSC are used when heat exposure, thermal stability, decomposition, phase transition, or reaction behavior is important to a materials or product decision.

Polymers and resins

Decomposition, glass transition, melting, curing, additives, filler content, and formulation comparison.

Battery materials

Thermal stability, solvent or binder behavior, decomposition, and heat-related material response.

Coatings and thin films

Curing, organic content, thermal stability, degradation, and formulation or process comparison.

Catalysts and powders

Moisture, volatile content, decomposition, oxidation, residue, and thermal-treatment behavior.

Simple submission process

How to submit a sample for TGA or DSC analysis.

Thermal-analysis planning depends on the expected temperature range, atmosphere, sample mass, and objective. Share the details first so the method can be reviewed.

01

Share sample details

Tell us the material, mass available, expected transitions, thermal history, and objective.

02

Receive suitability review

Our technical team reviews sample quantity, temperature range, atmosphere, and method suitability.

03

Confirm TGA or DSC route

Discuss temperature program, heating or cooling cycles, atmosphere, pans, and requested output.

04

Receive agreed outputs

Receive thermal curves, transition observations, mass-loss data, residue information, and agreed documentation.

Common questions

TGA and DSC analysis FAQs.

TGA analysis is used to investigate thermal stability, moisture or solvent loss, decomposition stages, oxidation behavior, filler content, and final residue as sample mass changes with temperature.

DSC analysis is used to investigate heat-flow events such as glass transition, melting, crystallization, curing, phase transitions, and thermal-history effects.

TGA or DSC may be suitable for polymers, resins, coatings, powders, catalysts, battery materials, composites, pharmaceuticals, ceramics, and other materials that can be tested within the required temperature and atmosphere conditions.

The required sample amount depends on the instrument method, pan, material, expected signal, and requested analysis. Share the available quantity during the suitability review so the appropriate route can be confirmed.

Share the material type, available mass, expected decomposition or transition range, atmosphere requirement, thermal history, and whether you need TGA, DSC, or both.

Technical content reviewed by G-Hexa Technical Team.

Last reviewed: September 30, 2026

Start your analysis

Need help selecting the right thermal-analysis route?

Share a few details for a technical review, or speak directly with our consultant by phone or WhatsApp.

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Just a few details — our technical team will guide you.